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 AEGIS
SEMICONDUTORES LTDA.
A5N:1000.XXH
VOLTAGE RATINGS
Part Number VRRM , VR - (V) rep. peak reverse voltage TJ = 0 to 125OC A5N:1000.22H A5N:1000.24H A5N:1000.26H A5N:1000.28H A5N:1000.30H A5N:1000.32H 2200 2400 2600 2800 3000 3200 Max. VRSM , VR - (V) Max. nonrep. peak reverse voltage TJ = 25 to 125OC 2300 2500 2700 2900 3100 3300
TJ = -40 to 0OC 2200 2400 2600 2800 3000 3200
MAXIMUM ALLOWABLE RATINGS
PARAMETER TJ Junction Temperature Tstg Storage Temperature IT(AV) Max. Av. current @ Max. TC VALUE -40 to 125 -40 to 150 1000 74 1600 14000 A 15000 937000 I2t Max. I2t capability 973000 I2t1/2 Max. I2t1/2 capability di/dt Max. Non-repetitive rate-ofrise current PGM Max. Peak gate power PG(AV) Max. Av. gate power +IGM Max. Peak gate current -VGM Max. Peak negative gate voltage F Mounting Force 46700 300 200 5 10 5 24500(5500) +- 10% kA2s1/2 A/ms W W A V N(Lbf) A2s 60 Hz half cycle sine wave t = 10ms UNITS
O O
NOTES 180 half sine wave 50 Hz half cycle sine wave Initial T J = 125 C, rated VRRM applied after surge. Initial T J = 125 C, rated VRRM applied after surge.
O O O
C C
A
O
C
IT(RMS) Nom. RMS current ITSM Max. Peak non-rep. surge current
A
t = 8.3 ms O Initial T J = 125 C, no voltage applied after surge. O I2t for time t x = I2t1/2 * tx1/2. (0.1 < tx < 10ms). TJ = 125OC, VD = VDRM, ITM = 3000A. Gate pulse: 20V, 20 W, apriximately 40% of non-repetitive value.
O
tp = 40 ms -
AEGIS
SEMICONDUTORES LTDA.
A5N:1000.XXH
CHARACTERISTICS
PARAMETER VTM peak on-state voltage VF(TO)1 Low-level threshold VF(TO)2 High-level threshold rT1 Low-level resistance rT2 High-level resistance IL Latching current IH Holding current td Delay time MIN. ----------------TYP. --------------0.7 MAX. 2.26 1.31 1.55 0.48 0.38 800 400 1.5 mW mA mA ms ms UNITS V V TEST CONDITIONS Initial TJ = 25 OC, 50-60Hz half sine, I eak = 3000A. p TJ = 125OC Av. power = V T(TO) * IT(AV) +rT * [IT(RMS)] , 180 Half Sine. Use low values for ITM < p rated IT(AV) TC = 125O C, 12V anode. Gate pulse: 10V, 20W, 100ms. TC = 25OC, 12V anode. Initial IT = 15A. TC = 25 C, VD = rated VDRM , 50A resistive load. Gate pulse: 10V, 20W, 20ms, 0.1ms rise time. TJ = 125OC, ITM = 1000A, di/dt = 25A/ms, VR = -50V. dv/dt = 20 V/ms lin. To 80% rated VDRM . Gate: 0V, 100W. TJ = 125OC, ITM = 1000A, di/dt = 25A/ms, VR = 1V. dv/dt = 600 V/ms lin. To 40% rated VDRM . Gate: 0V, 100W.
O
2
tq Turn-off time
---
125
250
tq(diode) Turn-off time with feedback diode IRM(REC) Recovery current QRR Recovered charge
-------
--93 166 ----15 40 20 --------------460(16.0) TO-200AD
50 ms ----1000 300 75 300 150 5 3 0.200 0.025 0.025 0.027 0.010 --O O
A mC TJ = 125O C, ITM = 1000A, diR/dt = 25A/ms. TJ = 125OC. Exp. to 100% or lin. To 80% V DRM , gate open. Higher dv/dt values avaliable.
dv/dt Critical rate-of-rise of off- 300 state voltage --IRM, IDM Peak reverse and offstate current IGT DC gate current to trigger VGT DC gate voltage to trigger VGD DC gate voltage not to trigger RthJC Thermal resistance, junction-to-case RthCS Thermal resistance, case-to-sink wt Weight Case Style ------0.3 0.3 ---------------
V/ms
TJ = 125OC, Exp. To 67% VDRM , gate open. mA mA V V TJ = 125 C, Rated VRRM and VDRM , gate open. TC = -40 C TC = 25 C TC = -40OC
O O O
+6V anode-to-cathode. For recommended gate drive see "Gate Characteristics" figure.
TC = 25OC TC = 25 OC, Max. Value which will not trigger with rated V DRM anode-to-cathode.
O
C/W DC operation, double side cooled. C/W 180 sine wave, double side coolde.
O C/W 120 rectangular wave, double side cooled.
O
O
C/W
Mtg. Surface smooth, flat and greased. Single side cooled. For double side, divide by 2. -----
g(oz.) JEDEC
AEGIS
SEMICONDUTORES LTDA.
A5N:1000.XXH
Maximum Allowable Case Temperature
130
130
Maximum Allowable Case Temperature
Maximum Allowable Case Temperature (C)
Maximum Allowable Case Temperature (C)
120
120 110 100
30
110
100
30
90
60
90
60 90
80 70 60
*Rectangular Waveform
90 120
DC
80
120 180
180
70 0 100 200 300 400 500 600 700 800 900 1000
*Sinusoidal Waveform
0
500
1000
Average Forward Current (A)
A1F:400.XXHY (Single Side Cooled) RthJ-hs(DC) = 0.09K/W A1F:400.XXHY (Single Side Cooled) RthJ-hs(DC) = 0.09K/W
Average Forward Current (A)
Fig. 1 - Current Ratings Characteristics
Fig. 2 - Current Ratings Characteristics
A1F:400.XXHY (Single Side Cooled) RthJ-hs(DC) = 0.09K/W
A1F:400.XXHY (Single Side Cooled) RthJ-hs(DC) = 0.09K/W
Maximum On-State Power Dissipation
12000
10000
Maximum On-State Power Dissipation
Maximum Average Forward Power Loss (W)
10000
Maximum Average Forward Power Loss (W)
30
30
8000
8000
60 90 120 180
60
6000
90 120
6000
4000
180 DC
4000
2000
2000
0 0 200 400 600 800 1000 1200 1400 1600 1800
*Sinusoidal Waveform
0 0
* Rectangular Waveform
500
1000
1500
Average Forward Current (A)
Average Forward Current (A)
Fig. 3 - On-state Power Loss Characteristics
Fig. 4 - On-state Power Loss Characteristics
AEGIS
SEMICONDUTORES LTDA.
A5N:1000.XXH
Forward Voltage Drop Characteristics
10
-1
Transient Thermal Impedance ZthJC
Transient Thermal Impedance ZthJC (C/W)
Steady State Value: RthJC=0.025 C/W (DC Operation)
Instantaneous Forward Current (A)
1000
10-2
100
10-3
125C
25C 10 0.5 1.0 1.5 2.0 2.5
10-4 10-3
10-2
10-1
100
101
102
Instantaneous Forward Voltage (V)
Time (s)
Fig. 5 - Forward Voltage Drop Characteristics
Fig. 6 - Transient Thermal Impedance ZthJC Characteristics
TO-200AD


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